Advanced Co-packaged

The packaging integration of Photonic Integrated Circuits (PIC) and Electronic Integrated Circuits (EIC) is critically important. Optical interconnects offer fundamental advantages including near-zero signal attenuation, ultra-low power consumption, high bandwidth, and compatibility with mature CMOS manufacturing ecosystems - all of which directly determine I/O bandwidth and energy efficiency. However, improper photonic-electronic integration can completely negate silicon photonics' inherent benefits, making advanced packaging technologies absolutely essential.