800G DR8 PIC
100G/lane, MZM, PAM4
100G/lane, MZM, PAM4
200G/lane, MRM, PAM4
200G/lane, MZM, PA
200G/lane, MRM, PAM4, CWDM4
200G/lane, MRM, PAM4
200G/lane, MRM, PAM4, CWDM4
400G/lane, MZM, PAM4
Our advanced Silicon PICs are based on Micro-Ring-Modulator (MRM) / Mach-Zehnder-Modulator (MZM) technologies.
By leveraging optimized device structures and proprietary design methodologies, our Photonic ICs support ultra-high data rates, compact integration, and reliable operation across a wide range of applications.
We deliver 1.6T and 3.2T PIC solutions for high-bandwidth optical communication in data center and AI compute cluster applications.
The ultra-low capacitance of the modulator results in extremely low switching energies. This energy efficiency is a critical enabler for high-performance computing and data center interconnects.
We integrate multiple optical functions such as modulation, multiplexing, routing, and detection on a single silicon chip. This creates a complete photonic system-on-a-chip.
Our PIC design enables large-scale photonic integrated circuits integrating thousands of components — a critical requirement for next-generation applications like CPO and optical I/O.
